1.Brief Introduction
1.1Use HP100M ultrasonic aluminum wire bonder, a kind of fully functional
COB bonding equipment improved on the base of HP100 series, is
principally used for the bonding of internal lead of such
semiconductors as entertainment integrated soft case chip, mobile
phone flasher, mini video camera integrated board, calculator,
telephone, music (audio) integrated circuit and thick-film
integrated circuit, etc. When its memory function is set as HOLD,
it is compatible with HP100 aluminum wire bonder and can be used
for bonding of digital display, lattice and back light.
1.2Theory and Features Utilizing the theory of ultrasonic friction, the bonder helps to
generate plastic deformation between aluminum wire and the welding
surface of the metal to reach a reliable contact through ultrasonic
friction and vibration under the combined effect of time and
pressure. In this way, metallic bond is produced between the two
metal atoms under the effect of affinity of the atoms to realize
the bonding of aluminum lead.
Since vertical guide rail up-and-down motion ( Z-oriented movement)
is used for the lathe head, second bond (span) is realized through
horizontal guide rail motion ( Y-oriented movement) of the lathe
head and both motions are driven by the step motor, aiming height,
loop height and jumper distance of first bond and second bond can
realize real digital control and various step parameters of every
lead can be memorized to reach real fully-functional memory (64× and 16× are optional). Accordingly, such advantages as reliable bonding
quality, precision of bonding spot control, high repetition rate of
bonding wire and good consistency of loop height are assured.
Second bond can be set as automatic bonding. The operator only
needs to press the bonding button on the maneuvering box to finish
the whole bonding in accordance with the parameters set at a higher
speed, which can greatly enhance the output. The rotary workbench
of the bonder can be changed to electric control rotation from
manual rotation according to the requirements of the user to not
only meet the requirements of the user for precision of microspur
bonding but also increase the speed. 2.Main Technical Parameters 2.1Electric Parameters: Power supply:AC 220V Frequency:50/60 Hz Power:150 W 2.2Operating Parameters: Circulation time:450 MSEL (the original setup) Bonding time:5~200 MSEL（20 MSEL/scale） 2.3Mechanical Parameters: X-oriented (horizontal movement area): < 80mm Y-oriented (automatic jumper distance scope): 0~8mm (digital
control) Z-oriented (vertical stroke of the lathe head): 25 mm (digital
control) Repetition precision of Y- and Z- oriented movement:12.5micron Rotary workbench:0.9°/pulse (configuration is optional) Over reset:10mm Height difference of bonding: 2~20mm Loop height:< 10 mm (digital control) Bonding area:< 20mm 2.4Bonding Parameters: Wiring angle of wire wedge: 30°/45° Diameter of aluminum wire: 0.7~1.6/18~40um Specific elongation:1~4% Bonding pressure:15~60gf (2 channels, electromagnetic regulation) Ultrasonic source power:0~3W (impedance:25) Ultrasonic source channel:2 (2 channels, precise regulation) Ultrasonic source frequency: 61~63.5khz (automatic follow) 3.Other Technical Parameters Magnification of microscope: 15 and 30 times as two selections of
magnification (standard configuration) Continuous magnification within 7 ~ 40 times (configuration is
optional) Size:600mm×560mm×390mm (L×W×H) Weight:25kg | 
